| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an element housing package capable of suppressing misalignment of the center of a through hole, and an electronic apparatus equipped with the same. <P>SOLUTION: An element housing package has a base 1; first and third side walls 2a, 2c as well as second and fourth side walls 2b, 2d disposed face to face with each other; a frame body having a cut-out portion 2f formed by cutting out a part of both side parts of the first and third side walls 2a, 2c; an input/output terminal 3 mounted to the cut-out portion 2f; a seal ring 5 on the top face of the frame body 2; and a lid body 7 on the top face of the seal ring 5. The widths of the second and fourth side walls 2b, 2d are narrower than those of the first and third side walls 2a, 2c, and the input/output terminal 3 is mounted to the cut-out portion 2f with both end faces 3e on the first and third side wall 2a, 2c side of the input/output terminal projecting toward the outside of the first and third side walls 2a, 2c. <P>COPYRIGHT: (C)2012,JPO&INPIT |
