| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic apparatus which can cool an electronic device as desired. <P>SOLUTION: An electronic device (IC) 16 is mounted on a substrate 15, a heat dissipation sheet 17 is provided on the electronic device 16, and a heat transmission cooling plate 18 is provided on the heat dissipation sheet 17 in close contact therewith. The substrate 15 and the heat transmission cooling plate 18 are fixed to a case 19 (housing) by means of a set screw 20. The heat transmission cooling plate 18 has a Z fold part 25 (height adjusting part) folded in Z-shape on one end side. The heat transmission cooling plate 18 is extended horizontally and fixed, at the end thereof, to the case 19 by means of a set screw 21. The Z fold part 25 can change the folding angle according to the height of the heat transmission cooling plate 18. <P>COPYRIGHT: (C)2012,JPO&INPIT |
