| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board having high-density fine wiring even for use in a core wiring conductor, and a method for manufacturing the same. <P>SOLUTION: A wiring board comprises: an insulating plate 1 having through-holes 3 vertically penetrating therethrough; through-hole conductors 4 coated on inner walls of the through-holes 3, the through-hole conductors being composed of a plated conductor; hole filling resins 6 filled in the through-holes 3; through-hole lands 5 formed around the through-holes 3 on an upper surface and a lower surface of the insulating plate 1 by a semi-additive method so as to electrically connect them to the through-hole conductors 4, the through-hole lands being composed of copper foil; lid plated parts 7 formed on the hole filling resins 6, the through-hole lands 5 and the insulating plate 1 by the semi-additive method so as to cover the filling resins 6 and the through-hole lands 5, the lid plated parts 7 being composed of a plated conductor; and wiring conductors 8 formed on the upper surface and the lower surface of the insulating plate 1 by the semi-additive method, the wiring conductors 8 being composed of a plated conductor. <P>COPYRIGHT: (C)2012,JPO&INPIT |
