SUBSTRATE INDUCTIVE DEVICES AND METHODS

摘要

Methods and apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a substrate based inductive device which utilizes inserted conductive pins in combination with plated substrates which replace windings disposed around a magnetically permeable core. In some variations this is accomplished without a header disposed between adjacent substrates while alternative variations utilize a header. In another embodiment, the substrate inductive devices are incorporated into integrated connector modules. Methods of manufacturing and utilizing the aforementioned substrate based inductive devices and integrated connector modules are also disclosed.