ADHESIVE COMPOSITION, CONNECTION STRUCTURE, METHOD FOR PRODUCING CONNECTION STRUCTURE, AND USE OF ADHESIVE COMPOSITION

摘要

Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface, wherein the first and/or the second circuit members are configured from a substrate containing a thermoplastic resin with a glass transition temperature of 200C or less. The disclosed adhesive composition contains (a) a thermoplastic resin, (b) a radical-polymerizable compound, and (c) a radical polymerization initiator, wherein (b) the radical-polymerizable compound contains urethane (meth)acrylate having a critical surface tension of 25-40 mN/m.