发明名称 CURABLE RESIN COMPOSITION, DRY FILM AND CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD USING THEM
摘要 <P>PROBLEM TO BE SOLVED: To provide a curable composition which is halogen-free, has high sensitivity, excels in soldering resistance, resistance to electroless gold plating, moisture resistance and resistance to electrode corrosion, and takes environmental problems into consideration; to provide a dry film and a cured product using the composition; and to provide a printed wiring board comprising their cured films. <P>SOLUTION: The composition includes (A) a curable resin derived from a compound having a structure expressed by formula (1), and (B) a curable resin composition having a layered double hydroxide such as hydrotalcite (in the formula R<SP POS="POST">1</SP>is an (m+l)-valent polyhydric alcohol derivative; m and n are each an integer of &ge;1 and <10; l is 0 or an integer of &ge;1; R<SP POS="POST">2</SP>is CH<SB POS="POST">2</SB>, C<SB POS="POST">2</SB>H<SB POS="POST">4</SB>, C<SB POS="POST">3</SB>H<SB POS="POST">6</SB>, C<SB POS="POST">4</SB>H<SB POS="POST">8</SB>, or a substituted or unsubstituted aromatic ring; and R<SP POS="POST">3</SP>is a substituted or unsubstituted aromatic ring). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012046691(A) 申请公布日期 2012.03.08
申请号 JP20100192193 申请日期 2010.08.30
申请人 TAIYO HOLDINGS CO LTD 发明人 OKAMOTO DAICHI;ARIMA MASAO
分类号 C08L67/02;C08J5/18;C08K3/20;G03F7/004;G03F7/027 主分类号 C08L67/02
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