CURABLE RESIN COMPOSITION, DRY FILM THEREOF, CURED PRODUCT OF SAID CURABLE RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME

摘要

In order to be halogen free and to be able to exert excellent solder heat resistance, electroless gold plating resistance, moisture resistance and resistance to electrode corrosion at a high sensitivity, a curable resin composition contains a curable resin (A) derived from a compound having a structure represented by general formula (1), and a layered double hydroxide (B). The curable resin composition and the dry film thereof can be advantageously used for the formation of a prepreg or a cured coating film such as a solder resist for a printed circuit board or a flexible printed circuit board. (In formula (1), R1 represents a polyhydric alcohol derivative having a valency of (m+l); m and n represent an integer of 1 or more and less than 10, 1 being an integer of 0 or at least 1; R2 represents CH2, C2H4, C3H6, C4H8 or a substituted or non-substituted aromatic ring; and R3 represents a substituted or non-substituted aromatic ring.)