A SEMICONDUCTOR AND A METHOD OF FORMING THE SAME

摘要

PURPOSE: A semiconductor chip and a method for forming a semiconductor chip are provided to uniformly maintain the thickness of a semiconductor chip by etching the back side of a semiconductor chip by using an insulating layer included in the substrate as an etch stopping layer. CONSTITUTION: A semiconductor layer(105) has an active surface(10) and an non-active layer(20) which face each other. A first inter layer dielectric layer(110) is formed on the active surface of the semiconductor layer. An insulating layer(103) is arranged on the non-active layer of the semiconductor layer. A through hole(115) successively passes through the first inter layer dielectric layer, the semiconductor layer, and the insulating layer. A spacer(125) is interposed between the inner wall of the hole and a through electrode.