| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a reliable photosensor by suppressing the generation of air bubbles between a fixing member for fixing a semiconductor wafer and a cover member and the cover member. <P>SOLUTION: A method of manufacturing a photosensor comprises the steps of: preparing a semiconductor wafer provided with a plurality of pixel regions; forming on the semiconductor wafer a lattice-shaped salient that surrounds each of the plurality of pixel regions by a fixing member; preparing a translucent substrate having on the surface thereof a gap part consisting of at least one of a lattice-shaped groove narrower in width than the line width of the lattice-shaped salient made by the fixing member and a plurality of through-holes arranged in a lattice shape; fixing the semiconductor wafer and the translucent substrate by disposing the lattice-shaped salient and the gap part in a mutually facing posture so as to constitute a vent hole on the fixing member; and cutting the semiconductor wafer and the translucent substrate that have been fixed to divide the pixel regions into individual pieces. <P>COPYRIGHT: (C)2012,JPO&INPIT |
