| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for a power module to which a heat sink can be joined easily and reliably. <P>SOLUTION: In the substrate for a power module, a metal plate as a circuit layer and a metal plate for heat dissipation layer are laminated in the thickness direction and joined, respectively, to both surfaces of a ceramic substrate. The substrate for a power module is warped such that the metal plate for circuit layer side becomes convex, and the amount of warpage is 0.1-0.3% in the thickness direction for the length in the longitudinal direction of the substrate for a power module. <P>COPYRIGHT: (C)2012,JPO&INPIT |
