发明名称 |
AQUEOUS METAL POLISHING AGENT COMPRISING A POLYMERIC ABRASIV CONTAINING PENDANT FUNCTIONAL GROUPS AND ITS USE IN A CMP PROCESS |
摘要 |
(A) solid polymer particles being finely dispersed in the aqueous phase and containing pendant functional groups (a1) capable of strongly interacting and forming strong complexes with the metal of the surfaces to be polished, and pendant functional groups (a2) capable of interacting less strongly with the metal of the surfaces to be polished than the functional groups (a1); and (B) an organic non-polymeric compound dissolved in the aqueous phase and capable of interacting and forming strong, water-soluble complexes with the metal of the surfaces to be polished and causing an increase of the material removal rate MRR and the static etch rate SER of the metal surfaces to be polished with increasing concentration of the compound (B); a CMP process comprising selecting (A) and (B) and the use of the CMP agent and process for polishing wafers with ICs. |
申请公布号 |
US2012058643(A1) |
申请公布日期 |
2012.03.08 |
申请号 |
US201013318911 |
申请日期 |
2010.04.19 |
申请人 |
RAMAN VIJAY IMMANUEL;GUBAYDULLIN ILSHAT;LI YUZHUO;BRANDS MARIO;LAN YONGQING;BASF SE |
发明人 |
RAMAN VIJAY IMMANUEL;GUBAYDULLIN ILSHAT;LI YUZHUO;BRANDS MARIO;LAN YONGQING |
分类号 |
H01L21/306;C09K13/00 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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