发明名称 Power semiconductor device for protective circuit for controlling motor of car, has insulation portion which insulates power semiconductor element, and heat dissipation plate is provided with flow communication portion for flow of coolant
摘要 <p>The device has a heat dissipation plate (2) consisting of metal, which is arranged at a lower surface of the power semiconductor element (1). An insulation portion (3) is arranged at the surface of the heat dissipation plate on the side opposite to a contact surface with the power semiconductor element, in order to insulate the power semiconductor element of a mounting surface (4) to the assembly of the power semiconductor element. The heat dissipation plate is provided with a flow communication portion (2a) for the flow of a coolant at the inside.</p>
申请公布号 DE102011081218(A1) 申请公布日期 2012.03.08
申请号 DE20111081218 申请日期 2011.08.18
申请人 MITSUBISHI ELECTRIC CORP. 发明人 MIYAMOTO, NOBORU;INOKUCHI, SEIICHIRO;TSUJI, NATSUKI
分类号 H01L23/46 主分类号 H01L23/46
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