| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to control the formation of a metal junction layer by preventing the lower layer of nano-diamond or compositions of a same layer to be diffused to solder. CONSTITUTION: A printed circuit board(100) comprises an insulating plate(110), a base pad(120) connected to a circuit pattern(125), and a solder resist(140) covering the circuit pattern. The insulating plate is composed of a thermosetting or thermoplastic polymer substrate, a ceramic substrate, an organic-inorganic complex material substrate, or a glass fiber impregnation substrate. A plurality of base pads is connected to a plurality of circuit patterns on the insulating plate. The circuit pattern and the base pad are formed into conductive materials. A first metal layer(130) is formed on the upper side and side of the circuit pattern and the base pad. The solder resist protects the surface of the insulating plate.
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