| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate support plate ensuring easy (convenient) measurement of the amount of superposition during manufacture of a wafer by a technology including a step for sticking a wafer to the substrate support plate, more preferably to provide a substrate support plate capable of preventing wraparound of temporary adhesive. <P>SOLUTION: The substrate support plate 1 is provided with a superposition limit area mark 2 formed on a main surface to which a wafer 10 is bonded and indicating the arrangement position limit of the wafer 10 on the main surface. <P>COPYRIGHT: (C)2012,JPO&INPIT |
