| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high reliable electrode structure on an insulation substrate constituting a surface mount device formed by mounting semiconductor chips on the insulation substrate, the electrode structure having front electrodes and back electrodes thereof connected via a plurality of connection electrodes, and furthermore in such electrode structure, to enable reliable inspection for a poor connection between either the front electrode or the back electrode and any of the connection electrodes. <P>SOLUTION: A semiconductor light-emitting device 100 formed by mounting a light-emitting element Ed on a ceramic substrate 101 includes: a front side cathode electrode 103 and a front side anode electrode 104 that are formed on the front surface of the ceramic substrate 101; and a back side cathode electrode and a back side anode electrode that are formed on the back surface of the ceramic substrate 101. The back side cathode electrode has plane patterns separated for each of two side electrodes 105, and the back side anode electrode has plane patterns separated for each of two side electrodes 106. <P>COPYRIGHT: (C)2012,JPO&INPIT |
