发明名称 CURABLE RESIN COMPOSITION AND MOLDED ARTICLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a curable resin composition having optical property, heat resistance and high moldability. <P>SOLUTION: The curable a resin composition containing: a polymer (A) which includes a main chain comprising carbon atom and a side chain having a polymerizable unsaturated bond group, and has a ring structure at the main and/or side chain; and a compound containing polymerizable unsaturated bond group. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012046726(A) 申请公布日期 2012.03.08
申请号 JP20110123260 申请日期 2011.06.01
申请人 FUJIFILM CORP 发明人 MOCHIZUKI HIROAKI;MOROOKA NAOYUKI;OKUTSU RIE;OBAYASHI TATSUHIKO
分类号 C08F265/06;C08F220/10 主分类号 C08F265/06
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