发明名称 |
LIGHT-EMITTING DIODE CHIP |
摘要 |
A light-emitting diode chip is specified, comprising - a semiconductor body (1) comprising a radiation-generating active region (13), - at least two contact locations (2a, 2b) for making electrical contact with the active region, - a carrier (3) and - a connecting means (4), arranged between the carrier (3) and the semiconductor body (1), wherein - the semiconductor body (1) has a roughening (15) at its outer surfaces facing the carrier (3), - the semiconductor body (1) is mechanically connected to the carrier (3) by means of the connecting means (4), - the connecting means (4) is in direct contact with the semiconductor body (1) and the carrier (3) in some locations, and - the at least two contact locations (2a, 2b) are arranged at the top side of the semiconductor body (1) that faces away from the carrier (3). |
申请公布号 |
WO2012028460(A2) |
申请公布日期 |
2012.03.08 |
申请号 |
WO2011EP64185 |
申请日期 |
2011.08.17 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH;HOEPPEL, LUTZ;VON MALM, NORWIN;SABATHIL, MATTHIAS |
发明人 |
HOEPPEL, LUTZ;VON MALM, NORWIN;SABATHIL, MATTHIAS |
分类号 |
H01L33/22;H01L25/075;H01L33/00 |
主分类号 |
H01L33/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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