| 摘要 |
Provided is a semiconductor package characterized by having: a wiring board provided with a substrate, a first conductive pattern disposed on one surface of the substrate, and a second conductive pattern disposed on the other surface of the substrate and electrically connected to the first conductive pattern; a semiconductor element joined to the surface of the substrate, on which the first conductive pattern is disposed, and electrically connected to the first conductive pattern; and a reinforcing member joined to at least one of the surfaces of the substrate. With the semiconductor package of the present invention, it is possible to inhibit or prevent the wiring board from warping, and the rigidity of the entire semiconductor package is increased. Moreover, the semiconductor package can exhibit excellent heat dissipation properties. |
