| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cooling apparatus capable of making a boundary layer into a thin film state, and capable of achieving adequate improvement of heat transfer coefficient. <P>SOLUTION: The cooling apparatus of an electronic apparatus having a plurality of members arranged in parallel to have a surface that faces a surface of another member, at least one of the members having a heat emission surface from which heat is discharged, has: a duct 100 with an opening 100a, from which a first air stream blows and flows along the heat emission surface in a first direction; and a duct 101 with an opening 101a, from which a second air stream blows and flows along the heat emission surface in a second direction that intersects the first direction. The center of the opening 101a is located opposite to the side on which the opening 100a is disposed, across a line 200c that passes through the center 200a of the heat emission surface. <P>COPYRIGHT: (C)2012,JPO&INPIT |
