发明名称 |
SILICON ETCHANT AND METHOD FOR PRODUCING TRANSISTOR BY USING SAME |
摘要 |
<p>The present invention provides: an etchant that selectively etches a silicon-made dummy gate and that is used for etching the silicon-made dummy gate in a method for removing the silicon-made dummy gate and replacing same with an aluminum metal gate to thereby produce a transistor that includes a laminate comprising at least a high dielectric material film and the aluminum metal gate; and a method for producing a transistor by using said etchant. Disclosed is a silicon etchant that is used for etching the silicon-made dummy gate and that contains: 0.1-40% by weight of at least one type of alkali compound selected from ammonia, diamines, and polyamines represented by general formula (1); 5-50% by weight of at least one type of polyol selected from polyols represented by general formula (2); and 40-94.9% by weight of water. Also disclosed is a method for producing a transistor by using the silicon etchant.</p> |
申请公布号 |
WO2012029450(A1) |
申请公布日期 |
2012.03.08 |
申请号 |
WO2011JP66997 |
申请日期 |
2011.07.26 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC.;SHIMADA, KENJI;MATSUNAGA, HIROSHI |
发明人 |
SHIMADA, KENJI;MATSUNAGA, HIROSHI |
分类号 |
H01L21/308;H01L21/28;H01L21/306;H01L21/336;H01L29/423;H01L29/49;H01L29/78 |
主分类号 |
H01L21/308 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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