发明名称 SILICON ETCHANT AND METHOD FOR PRODUCING TRANSISTOR BY USING SAME
摘要 <p>The present invention provides: an etchant that selectively etches a silicon-made dummy gate and that is used for etching the silicon-made dummy gate in a method for removing the silicon-made dummy gate and replacing same with an aluminum metal gate to thereby produce a transistor that includes a laminate comprising at least a high dielectric material film and the aluminum metal gate; and a method for producing a transistor by using said etchant. Disclosed is a silicon etchant that is used for etching the silicon-made dummy gate and that contains: 0.1-40% by weight of at least one type of alkali compound selected from ammonia, diamines, and polyamines represented by general formula (1); 5-50% by weight of at least one type of polyol selected from polyols represented by general formula (2); and 40-94.9% by weight of water. Also disclosed is a method for producing a transistor by using the silicon etchant.</p>
申请公布号 WO2012029450(A1) 申请公布日期 2012.03.08
申请号 WO2011JP66997 申请日期 2011.07.26
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC.;SHIMADA, KENJI;MATSUNAGA, HIROSHI 发明人 SHIMADA, KENJI;MATSUNAGA, HIROSHI
分类号 H01L21/308;H01L21/28;H01L21/306;H01L21/336;H01L29/423;H01L29/49;H01L29/78 主分类号 H01L21/308
代理机构 代理人
主权项
地址