PACKAGE ON PACKAGE

摘要

PURPOSE: A package on package is provided to simplify a process by directly connecting a bump of a top package and an elastic member. CONSTITUTION: A first package includes a first substrate and a first semiconductor chip. A second package includes a second substrate and a second semiconductor chip. The second package is laminated on the first package. The first package further includes an encapsulation material(230) and an elastic member(320) covering the first semiconductor chip. . A part of the elastic member is exposed from the encapsulation material.