| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible multilayer circuit board, which is capable of making electrical connection between layers while suppressing damage to an insulating layer due to heat. <P>SOLUTION: A method for manufacturing a flexible multilayer circuit board 1 includes: a preparation step P1 of preparing a first circuit layer 10 comprising a first insulating layer 11 and a first conductor layer 12, and a second circuit layer 20 comprising a second insulating layer 21 and a second conductor layer 22 and having holes 26a and 26b formed therein; a lamination step P2 of laminating the second circuit layer 20 on the first circuit layer 10 so that the second insulating layer 21 is arranged on at least a part of the first conductor layer 12, and the holes 26a and 26b overlap the first conductor layer 12; an arrangement step P3 of arranging solders 30a and 30b on the second conductor layer 22 so as to cover the holes 26a and 26b; and a heating step P4 of directly heating only the solders 30a and 30b to melt them, thereby connecting the solders 30a and 30b to the first conductor layer 12 and the second conductor layer 22. <P>COPYRIGHT: (C)2012,JPO&INPIT |
