METHOD FOR MANUFACTURING SMART CARD WITH IMPROVED CHIP BONDING PROCESS

摘要

The present invention relates to a method for manufacturing a smart card, and more specifically to a method for manufacturing a smart card with an improved chip bonding process which can reduce defects in the exterior of the product and can increase product yield by connecting an antenna terminal of an antenna coil and a connective terminal of a board through a conductive material using the indirect heat transmitted through a heat transfer path. The present invention provides the method for manufacturing the smart card including a COB module in which chips are mounted on the board wherein first and second connective terminals are connected to the heat transfer path having thermal conductivity on both sides thereof, comprising the steps of: arranging the antenna coil in a shape of a loop along an edge of one side of an antenna sheet by forming the antenna terminal at an end portion and providing chip arrangement holes in which the chips are inserted and arranged; laminating conductive balls which are conductively connected to the antenna terminal and inserting and arranging the chips into the chip arrangement holes so that the first and second connective terminals correspond to the conductive balls; providing heat and pressure for the heat transfer path using a heating bar so that the first and second connective terminals are connected to the antenna terminal using the indirect heat; laminating a module sheet having a board arrangement hole in which the board is inserted and arranged, on the antenna sheet; and laminating first and second external sheets on outer surfaces of the antenna sheet and the module sheet, respectively, the heating bar providing the heat having a temperature range of 350~450? for the heat transfer path for 1 to 2 seconds.