| 摘要 |
A heat dissipation apparatus includes a conductive board, a heat sink, and a thermo-electric cooler (TEC). The heat sink is mounted on the conductive board. The heat sink includes a base board defining a groove in a bottom of the base board. The TEC is accommodated in the groove, and a cooling surface of the TEC is coplanar with a bottom surface of the base board. A first part of the conductive board contacts the bottom surface of the base board. A second part of the conductive board contacts the cooling surface of the TEC. |
