| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device attachment module excellent in productivity and heat dissipation capability, a semiconductor light-emitting device lighting apparatus using the semiconductor light-emitting device attachment module, and a manufacturing method of the semiconductor light-emitting device attachment module. <P>SOLUTION: A plurality of semiconductor light-emitting device fixation portions 36, including a first conductive portion 28, a second conductive portion 32, and a first contact 39 and a second contact 43 whose each one end contacts to each of the first conductive portion and the second conductive portion, while the other end can be conductive to the anode and the cathode of the semiconductor light-emitting device, are formed in alignment. Further, there are provided a conductive plate 17 formed of a metal having a first power feed portion 25 and a second power feed portion 26, placed on both end portions, respectively conductive to the first conductive portion and the second conductive portion, and a surface insulation portion 48 formed of a resin material covering the surface of the conductive plate, in a state that the other ends of the first contact and the second contact, as well as the first power feed portion and the second power feed portion, are exposed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
