| 摘要 |
[Problem] To provide a resin composition for print circuit boards with a low coefficient for thermal expansion in the surface direction, superior heat resistance and drillability, and capable of maintaining a high degree of incombustibility; to provide a prepreg produced by using the resin composition thereof; and to provide a laminate and metal clad laminate using the aforementioned prepreg. [Solution] This resin composition comprises: an inorganic filler (A) which is a mixture of hydromagnesite and huntite, and expressed by the formula (1) [Formula 1] xMgCO3·yMg(OH)2·zH2O (1)(In this formula, x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4); an epoxy resin (B); and a curing agent (C). |
