| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a primer composition capable of obtaining a sufficient adhesion property and gas barrier property when a sealing layer of a silicone resin or the like is formed relative to a hardly adhesive substrate such as a polyphthalamide resin. <P>SOLUTION: The primer composition includes a polymerizable monomer having an epoxy group and an unsaturated group, an organic peroxide, and a diluting solvent. Further, the sealing structure body is suitable for LED, in which the primer composition is applied relative to the polyphthalamide substrate and is cured and the silicone resin layer is further formed on the primer layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
