发明名称 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component capable of easily being miniaturized and capable of simplifying a manufacturing process, and to provide a method of manufacturing the electronic component. <P>SOLUTION: An electronic component comprises: a printed circuit board that has a first surface and a second surface facing each other and in which predetermined through holes are formed; semiconductor elements that are installed in the through holes and are connected to the first surface; and one or more passive elements connected to the first surface. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012049527(A) 申请公布日期 2012.03.08
申请号 JP20110170978 申请日期 2011.08.04
申请人 SAMSUNG MOBILE DISPLAY CO LTD 发明人 YI KYEONG-IN;SEO SOENG-KO;CHUNG JAEMO
分类号 H01L33/62;H01L23/02;H01L23/12;H01L33/00;H05K1/18 主分类号 H01L33/62
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