发明名称 |
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component capable of easily being miniaturized and capable of simplifying a manufacturing process, and to provide a method of manufacturing the electronic component. <P>SOLUTION: An electronic component comprises: a printed circuit board that has a first surface and a second surface facing each other and in which predetermined through holes are formed; semiconductor elements that are installed in the through holes and are connected to the first surface; and one or more passive elements connected to the first surface. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012049527(A) |
申请公布日期 |
2012.03.08 |
申请号 |
JP20110170978 |
申请日期 |
2011.08.04 |
申请人 |
SAMSUNG MOBILE DISPLAY CO LTD |
发明人 |
YI KYEONG-IN;SEO SOENG-KO;CHUNG JAEMO |
分类号 |
H01L33/62;H01L23/02;H01L23/12;H01L33/00;H05K1/18 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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