| 发明名称 |
HEAT DISSIPATION MATERIAL AND LIGHT EMITTING DIODE PACKAGE INCLUDING A JUNCTION PART MADE OF THE HEAT DISSIPATION MATERIAL |
| 摘要 |
Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass. |
| 申请公布号 |
US2012056234(A1) |
申请公布日期 |
2012.03.08 |
| 申请号 |
US201113213730 |
申请日期 |
2011.08.19 |
| 申请人 |
LEE EUN SUNG;JEE SANG SOO;CHU KUN MO;KIM SE YUN;LEE KYU HYOUNG;LEE SANG MOCK;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE EUN SUNG;JEE SANG SOO;CHU KUN MO;KIM SE YUN;LEE KYU HYOUNG;LEE SANG MOCK |
| 分类号 |
H01L33/64;C22C45/00;H01L33/62 |
主分类号 |
H01L33/64 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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