发明名称 EPITAXIAL SILICON WAFER AND PRODUCTION METHOD THEREOF
摘要 Provided is an epitaxial silicon wafer in which the warping is reduced by rendering a cross-sectional form of a silicon wafer for epitaxial growth into an adequate form as compared with the conventional one. An epitaxial silicon wafer comprising a silicon wafer for epitaxial growth and an epitaxial layer is characterized in that the epitaxial layer is formed on a silicon wafer for epitaxial growth having a cross-sectional form satisfying a relation of a given expression.
申请公布号 US2012056307(A1) 申请公布日期 2012.03.08
申请号 US201113293843 申请日期 2011.11.10
申请人 KIHARA TAKAYUKI;TAKAISHI KAZUSHIGE;HASHIMOTO YASUYUKI;SUMCO CORPORATION 发明人 KIHARA TAKAYUKI;TAKAISHI KAZUSHIGE;HASHIMOTO YASUYUKI
分类号 H01L29/06 主分类号 H01L29/06
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