| 摘要 |
PURPOSE:To improve operation speed by providing the connection structure which can meet a transmissiin decline or radiation of signals caused by connection parts by design by connecting terminals of a package to terminals of a semiconductor chip with a distributing board. CONSTITUTION:Plural terminals 14 led out inside a package 11 are connected to plural terminals 15 formed on the surface of a semiconductor chip 12 with a distributing board 16 and a lid 17 is put on. The distributing board 16 is composed of an insulating substrate 18 made of a transparent sapphire plate on a back surface of which a transmission path 19 connecting the terminals 14 and 15 is formed are the transmission path 19 is connected to the terminals 14 and 15 with solder. The transmission path can be regulated minutely its material, shape, size or disposition by design and if necessary, it can be formed into a planer guide or a strip line, or one that includes circuit elements. Then it can meet a transmission decline or radiation of signals caused by connection parts by design. |
