Method for producing a metal structure on a surface of a semiconductor substrate

摘要

The method involves applying hot-melt ink such as hydraulic carbon wax or a photoresist on a patterning layer (5) formed on the surface of semiconductor substrate (1). The patterning layer is removed from substrate surface, after formation of metal layer covering patterning layer by sputtering deposition process, such that the patterning layer is covered by the metal layer and in the areas where the metal layer covers the patterning layer. The metal layer is peeled finally.