| 摘要 |
Heat-curable epoxy resin composition comprises: (a1) at least one solid epoxy resin having an average of more than one epoxide group per molecule; (a2) optionally at least one liquid epoxy resin with an average of more than one epoxide group per molecule; (b) at least one hardener for epoxy resins, which is activated by elevated temperature; (c) at least one carboxylic acid; (d) at least one hydroxyalkylamide or hydroxyalkylurea; and (e) and at least one accelerator, based on urea derivative for activation of the conversion of components (a1), and optionally (a2), with (b). Independent claims are also included for: (1) a reinforcing element for the reinforcement of metallic structures, comprising a support to which the heat-curable epoxy resin composition is applied; (2) bonding heat-stable substrates, comprising (i) applying a heat-curable epoxy resin composition to a surface of a heat-stable substrate, (ii) contacting the applied heat-curable epoxy resin composition with a surface of an additional heat-stable substrate, (iii) heating the heat-curable epoxy resin composition to a temperature of 100-220[deg] C, where the heat-stable substrate is made of a same or different material as the additional heat-stable substrate; and (3) a structural foam obtained by heating the heat-curable epoxy resin composition. |
