| 摘要 |
PURPOSE: A semiconductor integrated circuit is provided to increase net die per wafer by manufacturing a slave chip and a master chip with minimal circuits for operation. CONSTITUTION: A plurality of slave chips(320-340) comprises core regions(322,332,342), a global data line, and a first peripheral circuit region. The global data line transmits input/output data of the core region. The first peripheral circuit region interfaces the global data line and the core region. A master chip(310) comprises a second peripheral circuit region for providing an input/output interface of an external controller and a plurality of chip through vias(350-370) for data transmission. The plurality of chip through vias for data transmission respectively and vertically penetrates the plurality of slave chips. |
