发明名称 |
MANUFACTURING METHOD FOR A WIRING BOARD SHEET AND MANUFACTURING METHOD FOR A MULTILAYER BOARD |
摘要 |
<p>A Wiring board sheet which enables the miniaturization of a wiring board by mounting electric components (10) in an insulation layer (4) to increase the quantity of mounting electric components, has a high reliability, and undergoes a complicated manufacturing process, and a method for manufacturing the wiring board sheet. A multilayer board which is manufactured from this wiring board sheet, eliminates a difference in thermal histories during molding in each layer, simplifies the manufacturing process, and realize miniaturization by the scale-down and high-density of a conductor circuit and an improvement in reliability, and a method for manufacturing the multilayer board. <IMAGE></p> |
申请公布号 |
EP1445994(B1) |
申请公布日期 |
2012.03.07 |
申请号 |
EP20020777983 |
申请日期 |
2002.10.28 |
申请人 |
PANASONIC ELECTRIC WORKS CO., LTD. |
发明人 |
BABA, DAIZ;FUKUYA, NAOHITO;HIRABAYASHI, TATSUO |
分类号 |
H05K3/20;H05K1/18;H05K3/22;H05K3/40;H05K3/42;H05K3/46 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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