| 摘要 |
PURPOSE: An IC(Integrated Chip) card and manufacturing method are provided to solve environmental pollution by using a spot welding method which does not generate pollution materials. CONSTITUTION: An inlay layer(110) is attached on a front side and includes a copper coil(160). The both ends of the copper coil are arranged at the fixed area. An upper layer(120) is arranged on the front surface of the inlay layer and includes a COB(Chip On Board) reception groove(140). The COB(Chip On Board) reception groove is formed at the area corresponding to the fixed area. A lower layer(130) is arranged on the rear side of the inlay layer. A COB(150) includes a semiconductor chip including a first and a second contacting point. The both ends of the copper coil are connected with the first and the second contacting point by using a spot welding method. |
