METHOD FOR MANUFACTURING TAILESS PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME

摘要

PURPOSE: A method for manufacturing a printed circuit board without a lead line and the printed circuit board made by the same are provided to improve productivity by reducing an Au masking process from two processes to one process. CONSTITUTION: A pattern is formed by processing a via hole which passes through a substrate. A first insulation layer is formed by coating the upper and lower sides of the substrate including the pattern with insulating ink. A copper plating layer is formed for forming a plating lead line. A masking area is formed by a masking coating process. The copper plating layer exposed to the outside is removed by a soft etching process. The pattern exposed to the outside is coated with Au. The coated masking is removed by a masking separating process. The exposed copper plating layer in the masking separating process is removed by the soft etching process. A second insulation layer(208) is formed by coating the pattern exposed to the outside with the insulating ink.