PROCESS FOR PRODUCING METALLIZED CERAMIC SUBSTRATE, METALLIZED CERAMIC SUBSTRATE PRODUCED BY THE PROCESS, AND PACKAGE

摘要

The present invention is to provide a fabrication method for metallized ceramics substrate comprising the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive layer by firing the first conductive paste layer and the second conductive paste layer, wherein surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.