发明名称 Printed circuit board design support method and apparatus
摘要 A method used for supporting designing of a printed circuit board including a plurality of conductive layers having conductive areas to which a constant potential is applied, includes specifying conductive areas having a predetermined wiring from the conductive areas for each of the plurality of conductive layers, extracting areas that overlap each other in a planar view from the specified conductive areas, specifying an interlayer connection member that electrically connects at least two of the plurality of conductive layers in the extracted area, and clearly specifying an area within a predetermined distance from a center of the specified interlayer connection member and in the extracted area.
申请公布号 US8132145(B2) 申请公布日期 2012.03.06
申请号 US20080238895 申请日期 2008.09.26
申请人 SADAMATSU TOSHISATO;HAMA SHINICHI;KOBAYASHI SHIRO;CANON KABUSHIKI KAISHA 发明人 SADAMATSU TOSHISATO;HAMA SHINICHI;KOBAYASHI SHIRO
分类号 G06F17/50 主分类号 G06F17/50
代理机构 代理人
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