发明名称 |
Semiconductor package and method using isolated VSS plane to accommodate high speed circuitry ground isolation |
摘要 |
Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate which can have an integrated circuit die attached thereto. The package includes a dedicated high-speed ground plane that is electrically isolated from the ground plane used to ground the low speed circuitry of the package. |
申请公布号 |
US8129759(B2) |
申请公布日期 |
2012.03.06 |
申请号 |
US20090625457 |
申请日期 |
2009.11.24 |
申请人 |
OTHIENO MAURICE O.;CHIA CHOK J.;AMIN AMAR J.;LSI LOGIC CORPORATION |
发明人 |
OTHIENO MAURICE O.;CHIA CHOK J.;AMIN AMAR J. |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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