| 发明名称 |
Method of manufacturing an integrated circuit module |
| 摘要 |
A method includes providing an integral array of first carriers, arranging first semiconductor chips on the first carriers, and arranging an integral array of second carriers over the semiconductor chips.
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| 申请公布号 |
US8129225(B2) |
申请公布日期 |
2012.03.06 |
| 申请号 |
US20070837087 |
申请日期 |
2007.08.10 |
| 申请人 |
LANDAU STEFAN;KOENIGSBERGER ALEXANDER;MAHLER JOACHIM;SCHIESS KLAUS;INFINEON TECHNOLOGIES AG |
发明人 |
LANDAU STEFAN;KOENIGSBERGER ALEXANDER;MAHLER JOACHIM;SCHIESS KLAUS |
| 分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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