发明名称 |
Mounting structure of semiconductor device and electronic apparatus using thereof |
摘要 |
A mounting structure comprises at least one semiconductor device having solder bumps on a lower surface thereof as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is wrapped in a flexible wiring board; the mounting structure is provided with outer electrodes on both of a side on which the outer terminals of the semiconductor device are formed and an opposite side thereto; at least one wiring layer is formed on the flexible wiring board; and a supporting member is affixed between a lower surface of the semiconductor device on which the outer terminals are formed and the flexible wiring board.
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申请公布号 |
US8130503(B2) |
申请公布日期 |
2012.03.06 |
申请号 |
US20090411884 |
申请日期 |
2009.03.26 |
申请人 |
WATANABE SHINJI;YAMAZAKI TAKAO;NEC CORPORATION |
发明人 |
WATANABE SHINJI;YAMAZAKI TAKAO |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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