发明名称 |
Method for integrating heat transfer members, and an LED device |
摘要 |
Disclosed is a method for integrating at least two heat transfer members to provide an integrated composite member, the method comprising: a) disposing the at least two heat transfer members in a mold cavity, such that said heat transfer members each have at least one exposed surface forming a surface of a resin injection cavity; and b) injecting a thermally conductive resin into the resin injection cavity to contact the exposed surfaces of the at least two heat transfer members, to form the integrated composite member; wherein the thermally conductive resin has a thermal conductivity of at least 0.7 W/mK or higher. |
申请公布号 |
US8127445(B2) |
申请公布日期 |
2012.03.06 |
申请号 |
US20090414770 |
申请日期 |
2009.03.31 |
申请人 |
SAGA YUJI;UNE NARUMI;UCHIDA YOSHINOBU;E. I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
SAGA YUJI;UNE NARUMI;UCHIDA YOSHINOBU |
分类号 |
B21D53/02;H05K7/20 |
主分类号 |
B21D53/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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