发明名称 Method for integrating heat transfer members, and an LED device
摘要 Disclosed is a method for integrating at least two heat transfer members to provide an integrated composite member, the method comprising: a) disposing the at least two heat transfer members in a mold cavity, such that said heat transfer members each have at least one exposed surface forming a surface of a resin injection cavity; and b) injecting a thermally conductive resin into the resin injection cavity to contact the exposed surfaces of the at least two heat transfer members, to form the integrated composite member; wherein the thermally conductive resin has a thermal conductivity of at least 0.7 W/mK or higher.
申请公布号 US8127445(B2) 申请公布日期 2012.03.06
申请号 US20090414770 申请日期 2009.03.31
申请人 SAGA YUJI;UNE NARUMI;UCHIDA YOSHINOBU;E. I. DU PONT DE NEMOURS AND COMPANY 发明人 SAGA YUJI;UNE NARUMI;UCHIDA YOSHINOBU
分类号 B21D53/02;H05K7/20 主分类号 B21D53/02
代理机构 代理人
主权项
地址