| 摘要 |
PURPOSE: An adhesive composition for electronic components is provided to satisfy the penetrability of fine dusts between components and an adhesive sheet, and to have anti excitation/delamination/kink abilities under the severe condition of high temperatures and high humidity, and to restrain the generation of bubbles. CONSTITUTION: An adhesive composition for electronic components comprises an adhesive polymer of a monomer mixture, and the monomer mixture comprises 55-70 parts by weight of a (meth)acrylic acid ester based monomer having a C5-12 alkyl group, 25-35 parts by weight of a methyl(meth)acrylate monomer, and 5-10 parts by weight of a crosslinkable monomer. The (meth)acrylic acid ester based monomer having a C5-12 alkyl group is ethylhexl (meth)acrylate. The crosslinkable monomer is a monomer including a carboxylic group. The weight average molecular weight of the polymer is 1,000,000 - 1,700,000. |
