发明名称 |
Insulator for feedthrough |
摘要 |
A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture; the feedthrough assembly comprises a conductive element housed in a glass insulating member. A second substrate is coupled to the first substrate. |
申请公布号 |
US8129622(B2) |
申请公布日期 |
2012.03.06 |
申请号 |
US20090469823 |
申请日期 |
2009.05.21 |
申请人 |
TAYLOR WILLIAM JOHN;TISCHENDORF BRAD C.;MEDTRONIC, INC. |
发明人 |
TAYLOR WILLIAM JOHN;TISCHENDORF BRAD C. |
分类号 |
H01B17/26 |
主分类号 |
H01B17/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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