Integrated thermoelectric cooling devices and methods for fabricating same

摘要

Semiconductor integrated thermoelectric devices are provided, which are formed having high-density arrays of thermoelectric (TE) elements using semiconductor thin-film and VLSI (very large scale integration) fabrication processes. Thermoelectric devices can be either separately formed and bonded to semiconductor chips, or integrally formed within the non-active surface of semiconductor chips, for example.