发明名称 |
Apparatus and method for electroless deposition of materials on semiconductor substrates |
摘要 |
A method for electroless deposition from a deposition solution in a working chamber, where the process can include heating the deposition solution to its boiling point and subsequently reducing the temperature of the deposition solution to a working temperature range that is between approximately 1% and approximately 25% below the boiling point of said solution under a predetermined pressure; and the process also can include heating the deposition solution while filling an enclosed area of the chamber such that the deposition solution reaches its boiling point immediately after the enclosed area is filled. |
申请公布号 |
US8128987(B2) |
申请公布日期 |
2012.03.06 |
申请号 |
US20050138531 |
申请日期 |
2005.05.26 |
申请人 |
IVANOV IGOR C.;ZHANG JONATHAN WEIGUO;KOLICS ARTUR;LAM RESEARCH CORP. |
发明人 |
IVANOV IGOR C.;ZHANG JONATHAN WEIGUO;KOLICS ARTUR |
分类号 |
C23C18/16;H01L21/288 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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