PURPOSE: A semiconductor package is provided to reduce the height of the semiconductor package by mounting semiconductor chips in a first recess. CONSTITUTION: A substrate(100) includes a center part with a first recess(106) and an edge part with a second recess(108). The substrate includes a core(102) and a prepreg(104). A first pad(110) and a second pad(111) are arranged on the upper edge of the substrate. A third pad(112) is arranged in the center of the substrate. A connection pattern(120) is arranged in the second recess.
