| 摘要 |
PURPOSE: A sub board for mounting an electronic module is provided to improve the degree of integration by mounting electric devices in a laminating form. CONSTITUTION: A second frame layer(300) is attached on a part where a second electronic module connection terminal(121) is formed. The second frame layer forms one or more second recess portions(350). The second recess portion sets a part of a second side of an secondary printed circuit board layer(100) as a floor side. Fifth and sixth electronic module connection terminals(311,321) are electrically connected corresponding to the second electronic module connection terminal. The fifth and sixth electronic module connection terminals are respectively formed on at least a fifth side and a second side which are both sides of the second frame layer.
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