发明名称 |
LED PACKAGE AND METHOD OF MANUFACTURING LED PACKAGE |
摘要 |
PURPOSE: An LED package and a manufacturing method thereof are provided to improve thermal conductivity by directly mounting an LED chip on the metal substrate. CONSTITUTION: A first electrode(231) is adhered to a metal substrate(300). A second electrode(232) is separated from the first electrode on the metal substrate. The second electrode includes a penetration hole(600) which is larger than the size of the LED chip. The LED chip is directly mounted on the metal substrate. The LED chip is connected to the first electrode and the second electrode.
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申请公布号 |
KR20120019160(A) |
申请公布日期 |
2012.03.06 |
申请号 |
KR20100082377 |
申请日期 |
2010.08.25 |
申请人 |
HANA MICRON CO., LTD. |
发明人 |
JI, HYUN A;LEE, KYUNG WOO |
分类号 |
H01L33/48;H01L33/64 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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